An opportunity is available for an Electronics Assembly Quality Engineer to support AI development and evaluation projects. There are currently 4 openings available.
Job Responsibilities
- Analyze and interpret X-ray images of BGA, CGA, and LGA solder joints, identifying defects such as voiding, head-in-pillow, bridging, and opens.
- Review and suggest improvements to reflow soldering profiles to address process-related solder defects.
- Provide detailed root cause analysis and recommendations for solder joint anomalies and reliability concerns.
- Assess real-world cases for IPC Class 3 acceptance, documenting critical observations and decision criteria.
- Evaluate and outline test laboratory flows for counterfeit electronic component detection and screening.
- Deliver comprehensive written and verbal summaries of findings, ensuring clarity and actionable guidance.
- Contribute technical insights that enhance AI training data quality in the field of electronics assembly and component validation.
Compensation: $60 - $100/hr.
Location / Region: Remote.
Relevant skills include:
- X-ray inspection of area-array solder joints
- Reflow process
- Solder defect root cause
- Counterfeit electronic component screening
Pamper Me Network provides this concise opportunity summary for discovery. Review the official job listing for complete qualifications, availability, current terms and any additional responsibilities before applying.
